ESPECIFICACIONES técnicas
About the product
High-performance thermal paste specially designed for overclocking or gaming PCs. It comes with a 4g thermal paste that's easy to apply and perfectly fills the gap between the cooler and the CPU. Based on nanotechnology, this paste improves heat conduction through its micromolecules. Made with non-conductive materials, this thermal paste is completely safe to use. It comes with a spreader for quick and easy application.
Characteristics:
- Resealable storage bag for convenient use
- Very durable for long-term use of up to 8 years
- High viscosity allows for easy application.
- Nanotechnology improves heat conduction
- Non-electrically conductive materials ensure safe use
- Low evaporation point and high temperature tolerance.
- The spreader allows for quick and easy application
- It comes with 4 grams of thermal paste.
Ingredients:
- Silicone compounds 30%
- Carbon compounds 20%
- Oxide compounds 50%
Specs:
- Cog-4g Model
- Thermal conductivity >8.5 W/mK
- Thermal impedance <0.0016 ?-in2/W
- Specific gravity >3.25
- Viscosity 1000
- Thixotropic index 330 ±10
- MBT -50~340?
- OT -30~280?
Weight:
- Net weight 4g
